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OSP HASL Electronics PCB Assembly Communication Circuit Board
product description:
Model Number: | ZYX-21722BG | Place of Origin: | Shenzhen, China |
Type: | pcb assembly service | Brand Name: | BQZYX+ |
Number of Layers: | 1-48 layers | Base Material: | FR4, alum, FPC |
Copper Thickness: | 0.3-3oz | Board Thickness: | 1.6mm |
Min. Hole Size: | 0.1mm | Min. Line Width: | 3mil |
Min. Line Spacing: | 3mil | Surface Finishing: | HASL, OSP, Lead free |
Board Size: | Square,circle,irregular(with jigs) | Certificate: | ISO9001/IATF16949/ISO13485/ISO14001 |
MOQ: | 1 PCS | Testing Service: | AOI X-Ray Function Test |
1 | Material | FR4, (High Tg FR4, General Tg FR4, Middle Tg Fr4), Rogers High frequency material, Lead-Free Solder Sheet, Halogen Free FR4, Ceramic Filling Material, Teflon, PI Material, BT Material, PPO, PPE etc. |
2 | Board thickness | Mass production: 394mil(10mm) Samples: 17.5mm |
3 | Surface finish | HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
4 | PCB Max size | 1200mm × 560mm |
5 | Layer | Mass production: 1~58 layers / Pilot run: 64 layers, Flexible PCB: 1-12 Layers |
6 | Min hole size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) |
7 | Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
8 | Sanforized | Buried via, Blind via, Mixed Pressure, Embedded Resistance, Embedded Capacitance, Local Mixed Pressure, Local High Density, Back drill, impedance control. |
9 | PCBA QC | ICT,SPI,AOI online,X-ray, AOI offline, Functional Test |
10 | SMT Capacity | 800Million Points/Day |
11 | DIP Capacity | 0.6Million Points/Day |
12 | Our services | PCB, Turnkey PCBA, PCB Clone, Housing, PCB Assembly, Component sourcing, conformal coating spraying, Plastics&Molds, finished product assembly, aging test, PCB manufacturing from 1 to 64 layers,PCB circuit design,Free DFM check,Embedded Development,NPI trial production report.Lithium battery protection board solve scheme, Bluetooth, wifi and other module scheme. |
Q. What service can you supply ?
ZYX are OEM PCB and PCBA manufacturer since 2010 ,we can provide turnkey solutionincluding RD PCB fabrication,SMT and assembly PCBA inside the enclosure,Functiontesting and other value-added service.
Q. What file you need to prepare if you want to get an quotation from us?
For PCB board, you need to prepare files of Gerber file,it should including RS-274X,ODB++, DXF, PCB, PCBDOC etc formats.
For PCBA(PCB with soldered components), except the file for PCB, you also need to prepare the BOM list (components list), Pick and Place file(txt format), real sample pictureor 3D PDF version file etc.
Q. Do you have any MOQ Limited ?
We havent any limited about MOQ .Sample and mass production all can support.
Q. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q. How long does it take for PCB and PCBA Quote ?
PCBs quotation within 2 hours can finished the PCBA depend on the components
quantity,if simple, within 6 hours can finished,once complex and more,the 12- 36 hours
can be finished.
*Please note that the following detail will speed up evaluation:
Material:
Board thickness:
Copper thickness:
Surface finish:
Solder mask color:
Silkscreen color:
Q. How about the delivery?
Normally, for sample order, our delivery is about 5 days.For small batch, our delivery is about 7 days.
For mass production batch, our delivery is about 10 days.
But that depends on the real condition when we get your order.
If your order is urgently please contact us directly ,we will priority to deal it and do ourbest to give you satisfied delivery time.
Q. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.